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Abdullah, S.H.

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Author:  Ahmad, I.

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Issue DateTitleAuthor(s)
12006The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packagingAbdullah, S.H. ; Ahmad, I. ; Jalar, A. 
22004Some aspects of surface morphology and elemental analysis study on non-wetting problem at die topSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. 

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Abdullah, S.H.
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