Tan, L.C.

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4 2014
1 2012

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Author: Khan, N.

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	Issue Date	Title	Author(s)
1	2014	Stitch bond strength study in insulated Cu wire bonding	Leong, H.Y. ; Yap, B.K. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. ; Faiz, M.
2	2014	Manufacturability readiness of insulated Cu wire bonding process in PBGA package	Hungyang, L. ; Boonkar, Y. ; Yong, T.C. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C.
3	2014	Insulated Cu wire free air ball characterization	Leong, H. ; Yap, B. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C.
4	2012	Development of insulated Cu wire ball bonding	Leong, H.Y. ; Mohd, F.Z. ; Ibrahim, M.R. ; Kid, W.B. ; Khan, N. ; Kar, Y.B. ; Tan, L.C.
5	2014	Characterisation of insulated Cu wire ball bonding	Leong, H.Y. ; Yap, B.K. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. ; Faiz, M.

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Tan, L.C.

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