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Issue DateTitleAuthor(s)
12014Stitch bond strength study in insulated Cu wire bondingLeong, H.Y. ; Yap, B.K. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. ; Faiz, M. 
22012Development of insulated Cu wire ball bondingLeong, H.Y. ; Mohd, F.Z. ; Ibrahim, M.R. ; Kid, W.B. ; Khan, N. ; Kar, Y.B. ; Tan, L.C. 
32014Characterisation of insulated Cu wire ball bondingLeong, H.Y. ; Yap, B.K. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. ; Faiz, M. 

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Leong, H.Y.
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