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Retnasamy, V.

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Date Issued:  [2010 TO 2019]

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Issue DateTitleAuthor(s)
12013Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyKar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. 
22013Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUSKar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Fei, J.S. ; Retnasamy, V. 

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Retnasamy, V.
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