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Fei, J.S.

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Author:  Talik, N.A.

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Issue DateTitleAuthor(s)
12013Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUSKar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Fei, J.S. ; Retnasamy, V. 

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Fei, J.S.
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