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Kid, W.B.
Publications
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2011 | Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire | Kid, W.B. ; Leng, E.P. ; Seong, L.B. ; Weily, C. ; Kar, Y.B. |
| 2 | 2011 | Improvement of Cu-Al bond integrity on low k pad structures | Kid, W.B. ; Leng, E.P. ; Yong, C.C. ; Yi, O.X. ; Kar, Y.B. |
| 3 | 2012 | Development of insulated Cu wire ball bonding | Leong, H.Y. ; Mohd, F.Z. ; Ibrahim, M.R. ; Kid, W.B. ; Khan, N. ; Kar, Y.B. ; Tan, L.C. |
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Full Name
Kid, W.B.
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