Seong, L.B.

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	Issue Date	Title	Author(s)
1	2011	Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire	Kid, W.B. ; Leng, E.P. ; Seong, L.B. ; Weily, C. ; Kar, Y.B.

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Seong, L.B.

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Universiti Tenaga Nasional Library