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Please use this identifier to cite or link to this item: http://dspace.uniten.edu.my/jspui/handle/123456789/5315
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dc.contributor.authorAhmad, I.
dc.contributor.authorJiun, H.H.
dc.contributor.authorLeng, E.P.
dc.contributor.authorMajlis, B.Y.
dc.contributor.authorJalar, A.
dc.contributor.authorWagiran, R.
dc.date.accessioned2017-11-15T02:57:29Z-
dc.date.available2017-11-15T02:57:29Z-
dc.date.issued2006
dc.identifier.urihttp://dspace.uniten.edu.my:80/jspui/handle/123456789/5315-
dc.description.abstractThis paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that 1wt%Ag 0.5wt%Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results. © 2006 IEEE.
dc.titleA study on inter-metallic compound formation and structure of lead free SnAgCu solder system
item.grantfulltextnone-
item.fulltextNo Fulltext-
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