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Results 5151-5200 of 24054 (Search time: 0.0 seconds).

	Issue Date	Title	Author(s)
1	2010	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition	Harif, M.N. ; Ahmad, I.
2	2009	BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A.
3	2009	Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement	Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A.
4	2010	A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility	Chik, M.A. ; Yung, V.C. ; Balakrishna, P. ; Hashim, U. ; Ahmad, I. ; Mohamad, B.
5	2010	Characterization of fabrication process noises for 32nm NMOS devices	Elgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. ; Ziad, T.
6	2010	Numerical study of fluid flow and heat transfer in microchannel heat sinks using anisotropic porous media approximation	Lim, F.Y. ; Abdullah, S. ; Ahmad, I.

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