| Issue Date | Title | Author(s) |
1 | 2014 | Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method | Maheran, A.H.A. ; Menon, P.S. ; Shaari, S. ; Kalaivani, T. ; Ahmad, I. ; Faizah, Z.A.N. ; Apte, P.R. |
2 | 2013 | Threshold voltage optimization in a 22nm High-k/Salicide PMOS device | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Yusoff, Z. |
3 | 2014 | Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system | Adhila Muhammad, N. ; Bais, B. ; Ahmad, I. |
4 | 2014 | Statistical process modelling for 32nm high-K/metal gate PMOS device | Maheran, A.H.A. ; Noor Faizah, Z.A. ; Menon, P.S. ; Ahmad, I. ; Apte, P.R. ; Kalaivani, T. ; Salehuddin, F. |
5 | 2014 | Application of Taguchi method in designing a 22nm high-k/metal gate NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. |
6 | 2013 | Design and optimization of 22 nm gate length high-k/metal gate NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Salehuddin, F. |
7 | 2012 | High performance of a SOI-based lateral PIN photodiode using SiGe/Si multilayer quantum well | Menon, P.S. ; Tasirin, S.K. ; Ahmad, I. ; Abdullah, S.F. |
8 | 2012 | Modeling and optimizing of threshold voltage of 32nm NMOS transistor using L18 orthogonal array Taguchi method | Elgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. |
9 | 2012 | Statistical modeling of solar cell using Taguchi method and TCAD tool | Bahrudin, M.S. ; Abdullah, S.F. ; Ahmad, I. |
10 | 2012 | Technique to improve visibility for cycle time improvement in semiconductor manufacturing | Rahim, S.R.A. ; Ahmad, I. ; Chik, M.A. |
11 | 2012 | Design and optimization of 22nm NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. |
12 | 2011 | Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates | Muhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A. |
13 | 2012 | Robust optimization of a silicon lateral pin photodiode | Kalthom Tasirin, S. ; Susthitha Menon, P. ; Ahmad, I. ; Fazlili Abdullah, S. |
14 | 2012 | Morphology and optical properties of nickel oxide nanostructure from aqueous solution | Hamid, M.A.A. ; Bakar, M.A. ; Jalar, A. ; Shamsudin, R. ; Ahmad, I. |
15 | 2012 | Modelling of process parameters for 32nm PMOS transistor using Taguchi method | Elgomati, H.A. ; Majlis, B.Y. ; Hamid, A.M.A. ; Susthitha, P.M. ; Ahmad, I. |
16 | 2012 | Scaling down of the 32 nm to 22 nm gate length NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. |
17 | 2011 | Throughput improvement in semiconductor fabrication for 0.13μm technology | Balakrishna, P. ; Chik, M.A. ; Ahmad, I. ; Mohamad, B. |
18 | 2011 | Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging | Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
19 | 2011 | Message from chair of ED chapter, IEEE Malaysia section (Co-Chair RSM 2011) | Ahmad, I. |
20 | 2011 | Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader | Lim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. |
21 | 2011 | Optimization of HALO structure effects in 45nm p-type MOSFETs device using taguchi method | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. ; Elgomati, H.A. ; Majlis, B.Y. ; Apte, P.R. |
22 | 2016 | Process Parameters Optimization of 14nm MOSFET Using 2-D Analytical Modelling | Noor Faizah, Z.A. ; Ahmad, I. ; Ker, P.J. ; Siti Munirah, Y. ; Mohd Firdaus, R. ; Md Fazle, E. ; Menon, P.S. |
23 | 2010 | Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition | Harif, M.N. ; Ahmad, I. |
24 | 2009 | BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. |
25 | 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |
26 | 2010 | A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility | Chik, M.A. ; Yung, V.C. ; Balakrishna, P. ; Hashim, U. ; Ahmad, I. ; Mohamad, B. |
27 | 2010 | Characterization of fabrication process noises for 32nm NMOS devices | Elgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. ; Ziad, T. |
28 | 2010 | Numerical study of fluid flow and heat transfer in microchannel heat sinks using anisotropic porous media approximation | Lim, F.Y. ; Abdullah, S. ; Ahmad, I. |
29 | 2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |
30 | 2009 | Simulation of fabrication process VDMOSFET transistor using Silvaco software | Abdullah, H. ; Jurait, J. ; Lennie, A. ; Nopiah, Z.M. ; Ahmad, I. |
31 | 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
32 | 2008 | Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology | Nor, N.H.M. ; Taib, S. ; Ahmad, I. ; Abdullah, H. |
33 | 2009 | Optimization of PV-Wind-Hydro-Diesel hybrid system by minimizing excess capacity | Ab. Razak, J. ; Sopian, K. ; Ali, Y. ; Alghoul, M.A. ; Zaharim, A. ; Ahmad, I. |
34 | 2009 | Modelling and simulation single layer Anti-Reflective Coating of ZnO and ZnS for silicon solar cells using silvaco software | Abdullah, H. ; Lennie, A. ; Ahmad, I. |
35 | 2008 | Reduction of warpage occurrence on stack-die QFN using FEA and statistical method | Abdullah, I. ; Ahmad, I. ; Talib, M.Z.M. ; Kamarudin, M.N.B.C. |
36 | 2009 | Statistical design of ultra-thin SiO2 for nanodevices | Hashim, U. ; Abdul Fatah, M.F.A. ; Ahmad, I. ; Majlis, B.Y. |
37 | 2008 | Improved series resistance model for CMOS ESD diodes | Kamal, N.B. ; Kordesch, A.V. ; Ahmad, I.B. |
38 | 2008 | FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
39 | 2008 | The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA | Amin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. |
40 | 2008 | An experimental study of defect determination using pulsed thermal non-destructive testing | Umar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W. |
41 | 2008 | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging | Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
42 | 2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
43 | 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
44 | 2008 | The effect of surface texturing on GaAs solar cell using TCAD tools | Jalil, S.M. ; Abdullah, L. ; Ahmad, I. ; Abdullah, H. |
45 | 2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. |
46 | 2008 | Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer | Hamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I. |
47 | 2008 | An efficient first order sigma delta modulator design | Amin, N. ; Guan, G.C. ; Ahmad, I. |
48 | 2008 | Dicing laminated wafer for QFN 3D stacked die packaging | Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. |
49 | 2007 | Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish | Eu, P.-L. ; Ding, M. ; Ahmad, I. |
50 | 2007 | A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish | Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. |