Bais, B.
Results 1-2 of 2 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2014 | Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system | Adhila Muhammad, N. ; Bais, B. ; Ahmad, I. |
| 2 | 2011 | Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging | Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
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Bais, B.
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