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Issue DateTitleAuthor(s)
12011Process optimization approach in fine pitch Cu wire bondingWong, B.K. ; Yong, C.C. ; Eu, P.L. ; Yap, B.K. 
22006Lead-free flux effect in lead-free solder joint improvementEu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K. 
32007Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au FinishEu, P.-L. ; Ding, M. ; Ahmad, I. 
42006Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strengthEu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. 
52006Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performanceEu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. 
62007A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finishEu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. 

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Full Name
Eu, P.-L.
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