Yong, T.C.
Results 1-4 of 4 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2016 | The effects of zinc oxide on the sinterability of hydroxyapatite | Ching, T.Y. ; Singh, R. ; Yong, T.C. ; Kar, Y.B. |
| 2 | 2014 | Manufacturability readiness of insulated Cu wire bonding process in PBGA package | Hungyang, L. ; Boonkar, Y. ; Yong, T.C. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. |
| 3 | 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |
| 4 | 2012 | Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability | Kar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C. |
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Yong, T.C.
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