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Harif, M.N.
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2006 | The effects of high temperature storage on lead free solder joint material strength using pull test method | Harif, M.N. ; Ahmad, I. ; Zaharim, A. |
| 2 | 2010 | Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition | Harif, M.N. ; Ahmad, I. |
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Harif, M.N.
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