Publications
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Issue DateTitleAuthor(s)
12008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
22008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb 
32008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 

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Full Name
Lee, M.Y.
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