Researcher Profile Statistics: Jiun, H.H.

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Region	#
EU - Europe	188
AS - Asia, other	9
NA - North America	5
Total	202

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Country	#
AT - Austria	88
DE - Germany	57
FR - France	35
RU - Russian Federation	8
US - United States of America	5
KR - Korea	3
CN - China	2
TW - Taiwan	2
PH - Philippines	1
SG - Singapore	1
Total	202

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City	#
Vienna	88
Zhengzhou	2
Ashburn	1
Fairfield	1
Farmingdale	1
Hsinchu	1
Neubiberg	1
Singapore	1
Suwon	1
Venice	1
other	104
Total	202

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Most viewed items	#
ID: 5502 - Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping	58
Total	58

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Most type viewed	#
ID: other -	0
ID: journal -	0
ID: conference -	0
ID: patent -	0
ID: book -	0
ID: dataset -	0
ID: selected -	0
Total	0

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	Jan	Feb	Mar	Apr	May	Jun	Jul	Aug	Sep	Oct	Nov	Dec	Tot
2017	0	0	0	0	0	0	0	0	0	0	8	24	32
2018	12	8	16	9	20	6	0	7	17	11	13	12	131
2019	10	3	15	4	4	3	0	0	0	0	0	0	39
Ever													202