Researcher Profile Statistics: Jiun, H.H.

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Region	#
EU - Europe	304
NA - North America	48
AS - Asia, other	30
Total	382

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Country	#
DE - Germany	92
AT - Austria	88
RU - Russian Federation	50
US - United States of America	47
FR - France	43
SE - Sweden	26
CN - China	17
TW - Taiwan	5
GB - United Kingdom	3
KR - Korea	3
other - Other Country	13
Total	387

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City	#
Vienna	88
Saint Petersburg	31
Stockholm	16
Louisville	14
Dearborn	10
Fairfield	4
San Ramon	4
Taipei	3
Cambridge	2
Kuala Lumpur	2
other	213
Total	387

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Most viewed items	#
ID: 5502 - Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping	121
Total	121

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Most type viewed	#
ID: other -	0
ID: journal -	0
ID: conference -	0
ID: patent -	0
ID: book -	0
ID: dataset -	0
ID: selected -	0
Total	0

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	Jan	Feb	Mar	Apr	May	Jun	Jul	Aug	Sep	Oct	Nov	Dec	Tot
2020	0	0	0	0	0	0	7	5	2	0	4	5	23
2021	2	1	3	7	2	0	12	14	0	5	0	0	46
2022	0	0	0	0	0	0	0	0	0	0	0	5	5
2023	10	0	6	0	3	1	0	0	0	0	0	0	20
2024	0	0	0	9	0	0	0	0	0	0	0	0	9
2025	0	0	0	0	0	0	2	0	0	0	0	0	2
Ever													387