Condition Monitoring Through Temperature, Vibration and Radio Frequency Emission: A Review

Abstract

Condition monitoring (CM) is an important topic for researchers dealing with electrical equipment and their performance. The condition and performance of electrical equipment can be monitored through analysis of their temperature, vibration or radio frequency (RF) emission. In the past decades, intensive research works have been conducted to study CM with the aim to improve reliability and performance of electrical systems and hence the state of art of this area is felt important to be reviewed. This paper reviews the most recent and popular approaches which intend to improve the CM performance through temperature, vibration, and RF emission methods. A brief overview on existing monitoring methods is presented and from the comparison between the existing methods, it is concluded that with proper analysis and reliable measurements, RF emission can present an excellent tool for monitoring electrical equipment. It is believed that this review would give the readers a good insight on various schemes and approaches of CM of electrical equipment.