| Issue Date | Title | Author(s) |
| 1 | 2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |
| 2 | 2009 | Simulation of fabrication process VDMOSFET transistor using Silvaco software | Abdullah, H. ; Jurait, J. ; Lennie, A. ; Nopiah, Z.M. ; Ahmad, I. |
| 3 | 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
| 4 | 2008 | Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology | Nor, N.H.M. ; Taib, S. ; Ahmad, I. ; Abdullah, H. |
| 5 | 2009 | Optimization of PV-Wind-Hydro-Diesel hybrid system by minimizing excess capacity | Ab. Razak, J. ; Sopian, K. ; Ali, Y. ; Alghoul, M.A. ; Zaharim, A. ; Ahmad, I. |
| 6 | 2009 | Modelling and simulation single layer Anti-Reflective Coating of ZnO and ZnS for silicon solar cells using silvaco software | Abdullah, H. ; Lennie, A. ; Ahmad, I. |
| 7 | 2009 | Optimisation of N-channel trench power MOSFET using 2 k factorial design method | Nur, S.I. ; Ibrahim, A. ; Hafizah, H. |
| 8 | 2008 | Reduction of warpage occurrence on stack-die QFN using FEA and statistical method | Abdullah, I. ; Ahmad, I. ; Talib, M.Z.M. ; Kamarudin, M.N.B.C. |
| 9 | 2009 | Statistical design of ultra-thin SiO2 for nanodevices | Hashim, U. ; Abdul Fatah, M.F.A. ; Ahmad, I. ; Majlis, B.Y. |
| 10 | 2008 | Improved series resistance model for CMOS ESD diodes | Kamal, N.B. ; Kordesch, A.V. ; Ahmad, I.B. |
| 11 | 2008 | FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 12 | 2008 | The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA | Amin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. |
| 13 | 2008 | An experimental study of defect determination using pulsed thermal non-destructive testing | Umar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W. |
| 14 | 2008 | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging | Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
| 15 | 2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 16 | 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
| 17 | 2008 | The effect of surface texturing on GaAs solar cell using TCAD tools | Jalil, S.M. ; Abdullah, L. ; Ahmad, I. ; Abdullah, H. |
| 18 | 2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. |
