Showing results 41 to 60 of 141
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Issue Date | Title | Author(s) |
2006 | Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging | Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. |
2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |
2014 | Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method | Maheran, A.H.A. ; Menon, P.S. ; Shaari, S. ; Kalaivani, T. ; Ahmad, I. ; Faizah, Z.A.N. ; Apte, P.R. |
2010 | Effect of process parameter variations on threshold voltage in 45nm NMOS device | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. |
2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |
2011 | Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates | Muhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A. |
2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. |
2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2011 | Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader | Lim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. |
2014 | Effects of high-K dielectrics with metal gate for electrical characteristics of 18nm NMOS device | Atan, N.B. ; Ahmad, I.B. ; Majlis, B.B.Y. |
2000 | Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices | Omar, A. ; Ahmad, I. ; Alias, A.J. |
2003 | Electrical testing for MEMS's piezoresistive pressure sensor | Abd Wahab, M.Z.B. ; Sauli, Z.B. ; Ahmad, I. ; Suradi, W.B. |
2007 | Evaluation of different die attach film and epoxy pastes for stacked die QFN package | Ahmad, I. ; Bachok, N.N. ; Chiang, N.C. ; Talib, M.Z.M. ; Rosle, M.F. ; Latip, F.L.A. ; Aziz, Z.A. |
2006 | Fabrication of platinum membrane on silicon for MEMS microphone | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
2008 | FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
2006 | Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
2007 | HF etching of sacrificial spin-on glass in straight and junctioned microchannels for MEMS microstructure release | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
2012 | High performance of a SOI-based lateral PIN photodiode using SiGe/Si multilayer quantum well | Menon, P.S. ; Tasirin, S.K. ; Ahmad, I. ; Abdullah, S.F. |
2013 | High performance silicon lateral PIN photodiode | Tasirin, S.K. ; Menon, P.S. ; Ahmad, I. ; Abdullah, S.F. |
2018 | High-k Dielectric Thickness and Halo Implant on Threshold Voltage Control | Mah, S.K. ; Ahmad, I. ; Ker, P.J. ; Noor Faizah, Z.A. |