1. DSpaceCRIS@UNITEN

Amin, N.

Network Lab View Statistics Email Alert RSS Feed

Publications

Results 1-13 of 13 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
12008The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGAAmin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. 
22008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
32008FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvementLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
42011Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreaderLim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. 
52008Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. 
62010Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packagesAmin, N. ; Cheah, A.Y. ; Ahmad, I. 
72009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
82008Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array packageLim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. 
92009BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. 
102008An efficient first order sigma delta modulator designAmin, N. ; Guan, G.C. ; Ahmad, I. 
112008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
122008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
132009A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packagesAmin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. 

Profile

Loading... 2 0 5 0 false
Full Name
Amin, N.
Loading... 3 0 5 0 false