Leng, E.P.

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2 2010 - 2020
13 2000 - 2009

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Results 1-15 of 15 (Search time: 0.0 seconds).

	Issue Date	Title	Author(s)
1	2007	The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish	Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.
2	2006	Solder joint strength of lead free solders under multiple reflow and high temperature storage condition	Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S.
3	2007	Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish	Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A.
4	2007	Optimization of nickel thickness on substrate for TBGA using SAC387 solder material	Ahmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P.
5	2011	Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire	Kid, W.B. ; Leng, E.P. ; Seong, L.B. ; Weily, C. ; Kar, Y.B.
6	2008	Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing	Ling, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I.
7	2011	Improvement of Cu-Al bond integrity on low k pad structures	Kid, W.B. ; Leng, E.P. ; Yong, C.C. ; Yi, O.X. ; Kar, Y.B.
8	2008	FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I.
9	2009	Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement	Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A.
10	2009	BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A.
11	2006	A study on inter-metallic compound formation and structure of lead free SnAgCu solder system	Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R.
12	2008	A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint	Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A.
13	2007	A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish	Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.
14	2008	A study of lead-free BGA backward compatibility through solderability testing at component level	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I.
15	2007	A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish	Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A.

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