Publications
(Others)



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Issue DateTitleAuthor(s)
12006Solder bump strength and failure mode of low-k flip chip deviceEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. 
22006Impact of low-k devices on failure mode of flip chip tensile pull testEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. 
32006Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packagingEndut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. 

Full Name
Sukemi, N.M.
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