| Issue Date | Title | Author(s) |
| 1 | 2008 | Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer | Hamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I. |
| 2 | 2008 | An efficient first order sigma delta modulator design | Amin, N. ; Guan, G.C. ; Ahmad, I. |
| 3 | 2008 | Dicing laminated wafer for QFN 3D stacked die packaging | Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. |
| 4 | 2007 | Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish | Eu, P.-L. ; Ding, M. ; Ahmad, I. |
| 5 | 2007 | A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish | Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. |
| 6 | 2007 | Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods | Abdullah, I. ; Chiang, N.C. ; Mokhtar, U. ; Said, A. ; Talib, M.Z.M. ; Ahmad, I. |
| 7 | 2007 | Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish | Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. |
| 8 | 2007 | Evaluation of different die attach film and epoxy pastes for stacked die QFN package | Ahmad, I. ; Bachok, N.N. ; Chiang, N.C. ; Talib, M.Z.M. ; Rosle, M.F. ; Latip, F.L.A. ; Aziz, Z.A. |
| 9 | 2007 | Dicing die attach film for 3D stacked die QFN packages | Abdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R. |
| 10 | 2008 | Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging | Hamzah, A.A. ; Husaini, Y. ; Majlis, B.Y. ; Ahmad, I. |
| 11 | 2007 | Optimization of nickel thickness on substrate for TBGA using SAC387 solder material | Ahmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. |
| 12 | 2007 | A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
| 13 | 2007 | HF etching of sacrificial spin-on glass in straight and junctioned microchannels for MEMS microstructure release | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 14 | 2007 | The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. |
| 15 | 2007 | Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. |
| 16 | 2007 | The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
| 17 | 2007 | A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish | Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. |
| 18 | 2006 | A study on lead free SnAgCu solder system | Hoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. |
| 19 | 2006 | Fabrication of platinum membrane on silicon for MEMS microphone | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 20 | 2006 | Pulse power failure model of power MOSFET due to electrical overstress using tasca method | Ismail, N.S. ; Ahmad, I. ; Husain, H. ; Chuah, S. |
| 21 | 2006 | Study of lifetime prediction of N-MOS transistor due to hot carrier effect | Ahmad, I. ; Kornain, Z. ; Idros, M.F.M. |
| 22 | 2006 | Solder bump strength and failure mode of low-k flip chip device | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
| 23 | 2006 | Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging | Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. |
| 24 | 2006 | The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging | Abdullah, S.H. ; Ahmad, I. ; Jalar, A. |
