| Issue Date | Title | Author(s) |
| 1 | 2006 | The effects of high temperature storage on lead free solder joint material strength using pull test method | Harif, M.N. ; Ahmad, I. ; Zaharim, A. |
| 2 | 2006 | Performances test statistics for single outlier detection in bilinear (1,1,1,1) models | Zaharim, A. ; Mohamed, I. ; Ahmad, I. ; Abdullah, S. ; Omar, M.Z. |
| 3 | 2006 | TCAD Simulation of STI stress effect on active length for 130nm technology | Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Yew, P.T.B. |
| 4 | 2006 | Impact of low-k devices on failure mode of flip chip tensile pull test | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
| 5 | 2006 | The characterization of KrF photoresists and the effect of different chromophore bulkiness on line edge roughness (LER) for submicron technology | Yusri, A. ; Bakri, M. ; Manaf, M.J. ; Wahab, K.I.A. ; Ahmad, I.B. |
| 6 | 2006 | The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. |
| 7 | 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
| 8 | 2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 9 | 2006 | Solder joint strength of lead free solders under multiple reflow and high temperature storage condition | Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. |
| 10 | 2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |
| 11 | 2006 | TCAD simulation of local mechanical stress reduction by use of a compressive silicon nitride/silicon oxynitride etch stop bi-layer for CMOS performance enhancement | Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Chew, S.A. ; Yew, P.T.B. |
| 12 | 2006 | Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance | Eu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. |
| 13 | 2006 | Lead-free flux effect in lead-free solder joint improvement | Eu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K. |
| 14 | 2006 | Modelling of sacrificial spin-on glass (SOG) etching in non-straight microchannels using hydrofluoric acid | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 15 | 2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 16 | 2005 | Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 17 | 2004 | An alternative approach to measures the application of dispatching rule in the wafer foundry | Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. |
| 18 | 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 19 | 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 20 | 2006 | Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 21 | 2004 | A simulation approach for dispatching techniques comparison in 200mm wafer foundry | Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. |
| 22 | 2004 | Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 23 | 2004 | The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 24 | 2004 | Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM) | Kornain, Z. ; Ahmad, I. ; Omar, G. |
| 25 | 2004 | An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devices | Omar, A. ; Kamariah, S. ; Ahmad, I. |
| 26 | 2002 | Characterisation of polysilicon gate microstructures for 0.5 μm CMOS devices using transmission electron microscopy and atomic force microscopy images | Ahmad, I. ; Omar, A. ; Hussain, A. ; Mikdad, A. |
| 27 | 2004 | Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. |
