Showing results 7 to 26 of 141
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Issue Date | Title | Author(s) |
2008 | A study of lead-free BGA backward compatibility through solderability testing at component level | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
2007 | A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
2006 | A study on lead free SnAgCu solder system | Hoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. |
2006 | Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance | Eu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. |
2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2004 | An alternative approach to measures the application of dispatching rule in the wafer foundry | Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. |
2004 | An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devices | Omar, A. ; Kamariah, S. ; Ahmad, I. |
2008 | An efficient first order sigma delta modulator design | Amin, N. ; Guan, G.C. ; Ahmad, I. |
2008 | An experimental study of defect determination using pulsed thermal non-destructive testing | Umar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W. |
2018 | Analysis the effect of control factors optimization on the threshold voltage of 18 nm PMOS using L27 taguchi method | Bte Atanb, N. ; Majlis, B.Y. ; Ahmad, I. ; Chong, K.H. |
2010 | Analyze and optimize the silicide thickness in 45nm CMOS technology using Taguchi method | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. |
2011 | Analyze of input process parameter variation on threshold voltage in 45nm n-channel MOSFET | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. ; Elgomati, H.A. ; Majlis, B.Y. |
2014 | Application of Taguchi method in designing a 22nm high-k/metal gate NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. |
2011 | Application of Taguchi method in the optimization of process variation for 32nm CMOS technology | Elgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. ; Salehuddin, F. ; Hamid, F.A. ; Zaharim, A. ; Apte, P.R. |
2009 | BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. |
2002 | Characterisation of polysilicon gate microstructures for 0.5 μm CMOS devices using transmission electron microscopy and atomic force microscopy images | Ahmad, I. ; Omar, A. ; Hussain, A. ; Mikdad, A. |
2010 | Characterization and optimizations of silicide thickness in 45nm pMOS device | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. |
2010 | Characterization of a submicron PMOS in mixer circuits | Yeap, K.H. ; Ahmad, I. ; Rizman, Z.I. ; Chew, K. ; Chong, K.H. ; Yong, Y.T. |